Method of manufacturing a packaging substrate

ABSTRACT

The present invention provides a packaged substrate which has a superior positioning accuracy of wiring formed on a circuit substrate made of ceramics, and a conductive pattern with a thick film and yet a fine pattern. On a surface of flexible base member made of plastic, fine grooves are formed in a pattern corresponding to a first conductive pattern so that a cavity face is produced. Conductive paste is filled and into the grooves on this cavity face, and then dried. The cavity face and a circuit substrate are pasted with each other by applying predetermined heat and pressure. A pattern of the dried conductive paste is transcribed onto the circuit substrate, and then the first conductive pattern is formed by firing. A first ball solder is coupled with a second conductive pattern which is coupled to the first conductive pattern through an electrode in a through-hole of the circuit substrate.

FIELD OF THE INVENTION

The present invention relates to packaging substrates on whichsemiconductors are to be mounted and the method of manufacturing.

BACKGROUND OF THE INVENTION

In association with the progressive size reduction of electronicequipment in recent years, the electronic components used in suchelectronic equipment continue to be further reduced in size as well. Thesame pattern can be witnessed with semiconductor packages, where theball-grid array (BGA) is drawing attention because of its small size andease of mounting advantage over other packages coping with a largeincrease in number of terminal pins.

Among the BGA type packages, those using ceramic substrate are superiorin their ease of face-down mounting and heat dissipationcharacteristics, and are thus most suitable for further miniaturizationof packages especially for LSI's which dissipate a large quantity ofheat due to high speed signal transmission in devices such asmicroprocessors.

As disclosed in Japanese Laid-Open Patent Hei 8-88297, a ceramic typeBGA package (C-BGA) is composed of a ceramic multilayer wiring substratejoined with solder balls. FIG. 18 shows a conventional packagingsubstrate. In FIG. 18, C-BGA package 101 is composed of a multilayerceramic circuit substrate 102 joined with two or more types of solderballs 106 with different melting points for connection.

In this example of a conventional packaging substrate, when experiencingthermal hysteresis resulting from environmental changes, stress andstrain are caused in the solder balls due to the difference in thermalexpansion between the ceramic package and printed circuit board. The useof two or more types of solder balls is to solve the problem of lowreliability of connection such as breakage of connecting parts owing tothermal fatigue resulting from stress or strain, or breakage of theceramic package itself due to stress.

In order to make a multilayer ceramic circuit substrate 102 in thismethod, it is necessary to prepare several pieces of green sheetscomposed mainly of alumina as the base material; form via holes on eachof the sheets; form a wiring pattern; and fill the via holes with aconductive paste. A ceramic multi layer circuit substrate 102 isobtained by integrating each green sheet on which the wiring pattern hasbeen formed through the laminating, heating and pressurizing processes.

As another conventional example, a method of manufacturing a ceramicpackaging substrate in which fine wiring is formed on a ceramicsubstrate is disclosed in Japanese Laid-Open Patent Hei 7-202381. As theprocess is shown in FIG. 19, a conductive layer 202 is formed byprinting on the entire surface of a ceramic substrate 201, followed byforming an anti-sandblast resin pattern 203 on that part of the surfaceof the conductive layer where a conductor pattern is to be formed by aphoto-lithography process, and forming a conductor pattern 204 bypeeling off the anti-sandblast resin pattern after removing bysand-blasting processing the portion of the conductive layer where theaforesaid anti-sandblast resin pattern has not been formed. In thismethod, blotting of the conductor pattern, which usually occurs withscreen printing method, does not occur. Also, there is no dispersion ofthe height of the conductor pattern depending on locations and theflatness of the top portions of the pattern obtained is superior.

However, the conventional example described first has the followingproblems.

1) Since the formation of a wiring pattern is made by screen printing,it is extremely difficult to simultaneously make both the line width (W)and the line spacing (S) smaller than 75 μm.

2) When forming a wiring pattern by screen printing, the finer thepattern the thinner the film becomes. As an example, when W=75 μm, thefilm thickness obtained will be only 5 μm resulting in a high wiringresistance.

3) Especially when tungsten is used as the wiring material, the wiringresistance will be 3 to 5 times higher than that of silver and copper.As the pattern gets finer, this disadvantage becomes more conspicuous,in some cases making the use as electronic components impractical.

4) As the substrate and wiring material are simultaneously fired at suchhigh temperatures as approximately 900 to 1,600° C., material shrinkageof approximately 15-20% occurs after the firing, thereby causing a largedispersion in the dimensions of the substrate. The dispersion ofshrinkage causes a large dispersion in the dimension of the wiring,leading to inaccuracy of connection with the very fine bumps of a LSIand to a lowered yield of packaging.

5) Furthermore, in the case of forming of wiring pattern by screenprinting, the line width becomes wider than 75 μm (generally 120 μm orgreater is necessary when yield of printing and wiring resistance aretaken into account). In order to form many lines in a narrow area, it isnecessary to adopt a multi layer configuration of wiring, and as thenumber of layers increases and the dimensional precision becomes tighterto secure precision in mounting, the cost of the substrate increases.

On the other hand, the second example of the conventional method has thefollowing problems.

1) Since a conductive layer is individually formed by printing on theentire surface of a ceramic substrate and then that part of theconductive layer where the aforementioned anti-sandblast resin patternis not formed is removed by sandblasting, loss of expensive conductormaterial is large which is problematic from the standpoint of effectiveusage of resources, productivity is low due to dependence on thetime-consuming process of sandblasting, resulting in a cost increase inthe packaging substrate.

2) Also, as the process of individually forming an anti-sandblast resinpattern on a ceramic substrate by the use of photolithography includesthe processes of film formation, exposure, and developing, it has thedisadvantage of low productivity even though the precision is high.

3) A wiring pattern can be finely formed by photolithography, however,with the sandblasting method of removing a conductive layer, a desiredwiring pattern cannot be obtained unless the thickness of the conductivelayer is made thinner as the wiring pattern is made finer. For example,when forming a wiring with a line width of W=30 μm, thickness of theconductive layer should be approximately 10 μm or smaller in order toobtain a desired line width. Consequently, this example, too, has thedisadvantage of a high wiring resistance, making it inappropriate formost C-BGA's, especially for large-size C-BGA.

SUMMARY OF THE INVENTION

To solve these problems of the conventional methods and to provide asuperior packaging substrate, the present invention of a method ofmanufacturing a packaging substrate, wherein a first conductor patternis formed by intaglio printing on a circuit substrate and a firstball-shaped solder is joined to a second conductor pattern formed on theopposite side of said circuit substrate, comprises processes of:

(a) forming an intaglio on the surface of a flexible material by makinga patterned groove corresponding to the first conductor pattern,

(b) repeatedly filling and drying a conductive paste in the groove ofsaid intaglio,

(c) transferring the conductive paste pattern onto the circuit substrateby bonding the intaglio with said circuit substrate through applyingheat and pressure, and then peeling off said intaglio from said circuitsubstrate,

(d) firing said circuit substrate and said transferred conductive pastepattern.

The present invention of method of manufacturing a packaging substratemay further comprise (e) forming said second conductor pattern printedon the side of the circuit substrate opposite to said first conductorpattern, (f) connecting said second and first conductor patterns bymeans of a conductive material located in a through hole of the circuitsubstrate, and (g) joining the first ball-shaped solder to said secondconductor pattern on the circuit substrate.

The present invention of method of manufacturing a packaging substratemay further comprise a process of disposing an adhesive layer disposedbetween said circuit substrate and said intaglio after the process of(b).

In the present invention, the circuit substrate may be formed in amultilayer wiring configuration. Also, a surface roughness of saidcircuit substrate may be made larger on a printing surface of the secondconductor pattern than on a printing surface of the first conductorpattern.

Also, the method of manufacturing a packaging substrate of the presentinvention may comprise processes of forming a dielectric layer on top ofa portion of the first conductor pattern or the second conductorpattern, and forming a third conductor pattern on top of said dielectriclayer.

Also, the method of manufacturing a packaging substrate of the presentinvention may comprise processes of forming a thinner land portion ofthe first conductor pattern in a shallower groove of an intagliocomprising at least two depths of grooves, and electrically connectingan LSI chip having bumps through said bumps by face-down mounting onsaid thinner land portion of the first conductor.

Having the above processes, the present invention provides the followingadvantages.

1) The present invention makes it possible to form line width of awiring pattern to as fine as 10 μm. If a packaging substrate allows aline width of 30 μm, the thickness of the conductor can be made as thickas 30 μm, thus lowering the wiring resistance and allowing essentiallyall the wiring on a single layer of wiring to perform even in the caseof large-size multiple-terminal C-BGA.

2) Since the conductor pattern is formed on a ceramic substrate whichhas already been sintered, the present invention makes it possible tocontrol the precision of the land pattern for connection with LSI, andapproximately 100% yield of the face-down mounting of a LSI can beachieved. Also, as the land portion of conductor pattern can be madethin, displacement of a LSI while mounting can be minimized, therebybeing able to further raise the yield of mounting even when LSI bumppitch gets smaller.

3) As the line width of a wiring pattern can be made as fine as 10 μm,in addition to the effect described in 1) above, further miniaturizationbecomes possible by employing a multilayer configuration which allowsmounting of multiple LSI's.

4) As the surface roughness of the surface of the substrate on whichsolder balls are joined is large, bonding strength between the solderballs and conductor pattern and between conductor pattern and thesubstrate is large, and consequently mechanical strength and reliabilityof connection by the solder balls is high.

5) As the wiring pattern can be formed on a single layer, it is possibleto eliminate noise components by a simple construction of covering thepattern with a dielectric layer thereby providing an electrically stablepackaging substrate.

6) As the empty space in through holes of the substrate is filled withsolder, bonding strength between the solder balls and the substrate ishigh, resulting in high mechanical strength reliability of solder balls.Also, as the thermal conductivity of the solder is high, heat generatedin LSI can be efficiently transferred to the solder balls.

7) As a pillar-shaped solder can be formed with ease, it is easy todesign a construction in which the stress and strain resulting from thedifference of thermal expansion between the packaging substrate andprinted circuit board can be relieved by the pillar-shaped solderthereby enhancing the reliability of connection.

BRIEF DESCRIPTION OF THE DRAWING

FIG. 1(a) is a plan view of the wiring pattern of the packagingsubstrate in accordance with the first embodiment of the presentinvention.

FIG. 1(b) is a partially enlarged cross section of the packagingsubstrate.

FIG. 2 is a schematic diagram showing the process of filling conductivepaste onto an intaglio in the packaging substrate.

FIG. 3 is a schematic diagram showing the laminating process of theintaglio of the packaging substrate and a circuit substrate.

FIG. 4 is a schematic diagram showing transference process of thepackaging substrate.

FIG. 5 is a schematic diagram showing the firing process of a conductorpattern of the packaging substrate.

FIG. 6 is a partial cross section of a packaging substrate in accordancewith the second embodiment of the present invention.

FIG. 7 is a partial cross section showing another configuration of thepackaging substrate.

FIG. 8 is a partial cross section showing a packaging substrate inaccordance with the third embodiment of the present invention.

FIG. 9 is a partial cross section of a packaging substrate in accordancewith the fifth embodiment of the present invention.

FIG. 10(a) is a partial cross section of the packaging substrate duringthe process of filling a second solder.

FIG. 10(b) is a partial cross section showing the process of making theheight of the packaging substrate uniform after filling the secondsolder.

FIG. 11 is a partial cross section of a packaging substrate inaccordance with the sixth embodiment of the present invention.

FIG. 12 is a partial cross section of the packaging substrate aftermounting of an LSI chip.

FIG. 13 is a schematic diagram showing the process of filling conductivepaste onto an intaglio in the seventh embodiment of the presentinvention.

FIG. 14 is a partial cross section of the packaging substrate aftermounting of an LSI chip.

FIG. 15 is a partial cross section of a packaging substrate aftermounting of an LSI chip in accordance with the eighth embodiment of thepresent invention.

FIGS. 16(a), 16(b), 16(c) are diagrams showing the process of making apillar-shaped solder in a packaging substrate in accordance with theninth embodiment of the present invention.

FIGS. 17(a), 17(b), 17(c) are diagrams showing the process of making apillar-shaped solder in a packaging substrate in accordance with thetenth embodiment of the present invention.

FIG. 18 is a schematic cross section showing a conventional packagingsubstrate.

FIGS. 19(a) to 19(e) are diagrams showing the process of forming aconductor pattern in a conventional packaging substrate.

DESCRIPTION OF THE PREFERRED EMBODIMENT

(First Embodiment)

The first embodiment of the method of manufacturing packaging substratein accordance with the present invention will be explained as followsreferring to FIGS. 1 to 5. FIG. 1(a) shows an example of a wiringpattern of this embodiment and FIG. 1(b) shows a partial cross sectionof the wiring pattern.

As shown in FIGS. 1(a) and 1(b), the packaging substrate of thisembodiment has, for example, 289 input-output terminals in the form ofball-shaped solders with a spacing of 1.0 mm. FIG. 1(a) shows an exampleof the wiring pattern of a first conductor pattern 2, where the minimumline width of the conductor line is chosen to be 30 μm, the minimuminter-line spacing is 60 μm, and the conductor thickness after firing is30 μm. The electrode of the first conductor pattern 2 has a land portion61 at one end for connection with an LSI chip while another end leads toa through hole 3 of the circuit substrate 1 for connection with a secondconductor pattern 12 via electrode 32 in the through hole 3 and forfurther connection with a first ball-shaped solder.

Next, manufacturing method of this embodiment will be explained in thesequence of the process. First, a first conductor pattern 2 is made byintaglio printing. In FIG. 2, an intaglio 50 to be used is made byirradiating a laser beam in an ultraviolet region of 248 nm wavelengthon a 125 μm thick polyimide film of a flexible resin base material in aconfiguration corresponding to a desired wiring pattern using an excimerlaser apparatus. The laser-irradiated portions are decomposed byphotochemical reaction leaving a groove portion 53 corresponding to thewiring line of the first conductor pattern. In this embodiment, thewidth of the groove was chosen to be 30 μm and the depth of the groove50 μm. By using an excimer laser in this way, it is possible to make thegroove 53 with a width of 10 μm or smaller. Furthermore, the depth ofthe groove 53 can be arbitrarily adjusted with the depth larger than thewidth. This capability of providing a large aspect ratio is one of thefeatures of the intaglio 50.

When an excimer laser is employed for processing, any material whichdecomposes by photochemical react ion can be used as the flexible resinbase material including such other materials as polyethyleneterephthalate (PET) and polyetherimide (PEI). When the polyimide filmused as the flexible resin base material, the intaglio 50 cannot beeasily peeled from the conductive paste 52 filled in the groove 53. Inorder to avoid the conductive paste 52 remaining inside the groove 53after the transference process, a peeling layer (not shown in thedrawings) is formed on the surface of the intaglio 50, especially on thesurface of the groove 53. A monomolecular film of carbon fluoride isused as the peeling layer.

Subsequently, a silver paste as the conductive paste 52 is coated on thesurface of the intaglio 50 on which the peeling layer has been formed.By wiping the coated surf ace of the intaglio 50 with a squeegee, extrasilver paste on the intaglio surface was removed and at the same timethe groove 53 could be thoroughly filled with the silver paste. Thefilled paste was dried in a drier together with the intaglio 50 toevaporate the organic solvent contained in the silver paste. During thisprocess, volume of the silver paste filled in the groove 53 decreases byan amount equal to the evaporated amount of the organic solvent. Inorder to complement this volume reduction, processes of filling silverpaste and drying is repeated again. Through this repetition, thethickness of the silver paste after drying can be made approximatelyequal to the depth of the groove 53. In this embodiment, filling anddrying were repeated three times.

Next, to transfer the conductor pattern on the circuit substrate 1, anadhesive layer 54 composed of a thermoplastic resin is provided betweenthe surface of the flexible substrate having intaglio and the circuitsubstrate 1. As schematically illustrated in FIG. 3, the side of theintaglio 50 having the groove 53 filled with dried conductive paste 62is facing the adhesive layer 54. Then the intaglio 50 and the circuitsubstrate 1 are put together by applying heat and pressure Here, a firedceramic substrate was used as the circuit substrate 1. As will be setforth later, as the thickness of the adhesive layer increases, theconductor pattern cannot be properly formed due to the combustion of theadhesive layer 54 itself and the shrinking force during firing. It hasbeen confirmed by experiments that a thickness of The adhesive layer 54of 20 μm or smaller is appropriate. The temperature of putting togetherwas chosen to be 130° C. This temperature was determined based on thefinding that a good transferability could be obtained at a temperatureapproximately 30° C. higher than the glass transition temperature of thethermoplastic resin employed. The thermoplastic resin was prepared bydip-coating on the surface of the circuit substrate 1 a solution ofbutylcarbitol acetate (BCA) dissolved with polyvynilbutyral (PVB) anddrying. Through this process, a PVB layer with a thickness of 5 μm canbe formed on the entire surface of the circuit substrate as an adhesivelayer 54. In addition to the dip-coating method, spinner method,roll-coater method, or screen printing method can also be employed forcoating a PVB layer.

In the meantime, there usually exists on the surface of a circuitsubstrate 1 waviness with a magnitude of at least approximately 30 μm.When an intaglio is made of an inflexible material such as glass,because its hardness and rigidity are too high, it cannot fully followthe waviness of the substrate at the time of putting together. Animplementation based on the use of a flexible resin for the intaglio asin the present invention can fully cope with the wavy configuration ofthe substrate and provides a manufacturing method with a superiortransferability.

Next, as the transference process, the intaglio 50 is peeled from thecircuit substrate 1 after decreasing the temperature of the intaglio 50to room temperature and the circuit substrate 1 which have been puttogether, and the dried conductive paste 62, being the first conductorpattern configured to the wiring pattern, is transferred. In doing this,it is possible to bend the intaglio 50 to an angle greater than 90° asshown in FIG. 4 because of the flexibility of the intaglio 50. As aresult, since the peeling of the intaglio 50 from the circuit substrate1 is along the lines, the force required for peeling is reduced makingit easy to peel the intaglio 50.

Subsequently, the circuit substrate 1 on which the dried conductivepaste 62 has been transferred as described above is fired under atemperature profile having a peak at 850°. As the circuit substrate 1 tobe fired has a construction in which the conductor pattern has beenformed via the adhesive layer 54, depending on the firing conditions,vigorous combustion gas may evolve from the adhesive layer 54 causingpeeling or deformation of the conductor pattern, which will result in adefect. In order to avoid such trouble, it is desirable to maintain thetemperature gradient at 200° C./hour or below in the temperature range200° C. to 500° C. which corresponds to the temperature range from thestart of firing of the adhesive layer 54 to the end.

After studying the relationship between the temperature conditions andthe thickness of the adhesive layer, it has been confirmed that, whenthe thickness of the adhesive layer is smaller than 20 μm, there is nodeformation of the conductor pattern or peeling of the conductor patternduring firing under the above temperature conditions. Based on the aboveprocess, the first conductor pattern 2 was formed with a minimum linewidth of 30 μm, a minimum line spacing of 60 μm, and a conductorthickness of 30 μm after firing. The electrical resistance of the firstconductor pattern was 0.2 Ω at the longest line-length part. Also thearea resistance R_(s) of the conductor was 0.7 m Ω (area resistanceR_(s) =p×L/S (p: resistivity L: length of wiring S: cross section areaof wiring) which are very low as a wiring resistance.

Next, in forming the electrode inside through hole 32, a conductivepaste is sucked into the through hole by air suction force from both theside of the first conductor pattern 2 and the second conductor pattern12, thereby coating the through hole with the conductive paste, followedby drying and firing. Here, the conductive paste used was Ag--Pd paste,which is the same as that used in the second conductor pattern to be setforth later. The peak firing temperature was 850° C.

Formation of the second conductor pattern 12 will now be described. Inthis case, as the required line width or line spacing of the secondconductor pattern is not needed to be particularly fine, a conventionalscreen printing method was employed. However, when a fine pattern isrequired for the second conductor 12, too, it can be formed by exactlythe same method as that of the first conductor pattern 2 as described inthis embodiment. Here, the same Ag--Pd paste as used in the electrode 32inside the through hole was used as the conductive paste.

Next, for the formation of the first ball-shaped solder 4, 0.5 mmdiameter spheres of a high-melting-point solder having a composition ofPb (90%) and Sn (10%) are prepared and are appended in line on thecertain point of the second conductor pattern 12 of which the locationsfor appending the solder balls have been coated with a flux in advance.The appended solder balls are melted in a reflow furnace at 340° C. in anitrogen atmosphere and joined to the second conductor pattern as shownin FIG. 1(b) thereby producing a complete packaging substrate.

Further the conductor patterns can be applied with non-electrolyticNi--Au metal plating for protection of the conductors. Although a fluxwas coated on the second conductor pattern 12 for the purpose of joiningto the first ball-shaped solder 4, it is also possible to coat aneutectic solder (Pb 64%:Sn 36%) by screen printing and appending on theeutectic solder the ball-shaped solder and joining it in a reflowfurnace at 240° C. Furthermore, instead of the flexible resin basematerial of the intaglio used here, a metallic base material can also beused for the intaglio.

According to the present embodiment a large conductor thickness, forexample 30 μm, can be realized for a line width of 30 μm, therebyproviding a very low wiring resistance-and suggesting possibility ofmaking all or most or the wiring on a single layer even in the case of alarge multiple-pin packaging substrate.

As the conductor pattern is formed on a ceramic substrate which isalready sintered, it is possible to control the precision of the landpattern for connection with an LSI chip with a dispersion of an order ofseveral μm, and to achieve an yield of almost 100% in face-down mountingof LSI chips.

Since the line width of wiring pattern can be made as fine as 10 μm,further size reduction may be possible by employing a multilayerconfiguration. Also mounting of multiple LSI chips on one circuitsubstrate may become possible.

Since the wiring pattern can be formed on a single layer, it becomespossible to eliminate noise by simple construction of covering thepattern with a dielectric material thereby obtaining an electricallystable packaging substrate.

(Second Embodiment)

Referring to FIG. 6 and FIG. 7, a second embodiment of the manufacturingmethod of packaging substrate in accordance with the present inventionis explained in the following. FIG. 6 and FIG. 7 show partial crosssections of the present embodiment. In this embodiment, a green sheet isused to form the circuit substrate.

A green sheet is formed by a slurry which is a mixture of powder, suchas glass powder or Al powder and the like, and a binder in a sheet form.A binder here is liquid resin or solution of resin powder in a solvent.

In this embodiment, a green sheet containing glass ceramic materialwhich can be sintered at a low temperature is used as an unsinteredgreen sheet. Holes are punched on the green sheet at predeterminedpositions for formation of through holes, followed by filling Ag--Pdpaste as a conductive paste in the through holes by screen printing, anddrying to form electrode 32 inside the through holes.

Next, the side of the green sheet on which the first conductor pattern 2is to be formed was coated with a solution of BCA dissolved with PVBusing a roll coater, and then dried. On the other hand, the filling of aconductive paste onto an intaglio and drying were performed in the samemanner as in the first embodiment. The green sheet was cut topredetermined dimensions and laminated with the intaglio in the samemanner as in the first embodiment, the conductor pattern wastransferred, and a first conductor pattern 2 was obtained on the greensheet.

A second conductor pattern 12 was formed by screen printing Ag--Pdpaste, followed by firing of the green sheet together with the secondconductor pattern under a temperature profile having a peak temperatureat 900° C. As a result of firing, the green sheet shrank by about 15%and a ceramic substrate 11 was obtained. The groove pattern of theintaglio had been designed with an allowance in anticipation of theshrinkage.

Next, a first ball-shaped solder 4 was formed in exactly the same way asin the first embodiment, and a packaging substrate was completed.

In this embodiment, as the inside of through holes is totally filledwith Ag--Pd, it is also possible to connect the first ball-shaped solder4 directly underneath the electrodes 32 inside the through holes asshown in FIG. 7. Here, although a glass ceramic based material which canbe fired at a low temperature was used as an unfired green sheet, it isalso possible to use an alumina based material for high temperaturefiring, in which case tungsten paste is to be used as the conductivematerial, a mixture of nitrogen and hydrogen as the firing atmosphere,and firing is to be made at a peak temperature in the range 1,500° C. to1,600° C. Furthermore, instead of coating on the surface of the greensheet where the first conductor pattern is to be formed a solution ofBCA dissolved with PVB as done here, the binder of the green sheet canalso be utilized to place the first conductor pattern on the greensheet.

In this embodiment, too, as it is possible to form a fine and thickconductor pattern by intaglio printing, the wiring resistance isextremely low, suggesting possibility of forming all or most of thewiring on a single layer even in the case of a large, multiple-pinpackaging substrate.

(Third Embodiment)

A third-embodiment of the manufacturing method of a packaging substrateaccording to the present invention will be explained in the followingreferring to FIG. 8. First, formation of a multilayer circuit substrateshown in FIG. 8 will be explained. A multilayer circuit substrate 21consisting of a lamination of 3 substrates is shown as an example. Tomake individual substrates, green sheets containing glass ceramic with alow sintering temperature were prepared as in the second embodiment.Holes were punched on these green sheets at predetermined positions tomake via holes, which were then filled with a conductive Ag--Pd paste byscreen printing. The green sheets were then dried and the electrodes 42inside via holes were formed.

Next, in order to form internal wiring electrode 41 on one side or bothsides of a green sheet, patterns were formed by screen printing Ag--Pdpaste. By heating under pressure a stack of 3 green sheets, a laminatedmultilayer-wired green sheet was obtained.

A first conductor pattern 2 was then formed on the laminated green sheetby transference with an intaglio as in the second embodiment, a secondconductor pattern 12 was formed by screen printing, and the circuitsubstrate and the second conductor thereon is fired at 900° C.

A first ball-shaped solder 4 was then formed in the same manner as inthe first and second embodiments and a complete packaging substrate wasobtained.

In this embodiment, although a glass ceramic based material which can befired at a low temperature was used for the green sheet, it goes withoutsaying that an alumina based material for high temperature firing canalso be used. In that case, tungsten paste is to be used as the wiringmaterial for the multilayer wiring substrate, a mixture of nitrogen andhydrogen is to be used as the firing atmosphere, and firing is to bemade at a peak temperature in the range 1,500° C. to 1,600° C.Additionally, the first and second conductor patterns can be formed byintaglio printing and screen printing on the surface using a copperpaste after a sintered multilayer-wired packaging substrate 21 has beenobtained, and by firing the assembly in a nitrogen atmosphere at a peaktemperature of 850° C., thus obtaining a complete packaging substrate.

In this embodiment, too, as it is possible to form fine and thickconductor patterns by intaglio printing, the obtained wiring resistanceis extremely low. In addition, since multilayer wiring is also possible,this method of manufacturing is effective in miniaturizing packagingsubstrate especially when two or more LSI chips are to be mounted andwiring crosses each other.

(Fourth Embodiment)

Referring to FIG. 1(b), a fourth embodiment of the manufacturing methodof a packaging substrate in accordance with the present invention willbe explained in the following.

In FIG. 1(b), the required surface condition of the circuit substrate 1is different on the side on which a first conductor pattern 2 is to beformed and on the side on which a second conductor pattern 12 is to beformed because the purposes of the surfaces are different. In order toallow formation of a fine pattern and a low wiring resistance, surfaceroughness of the side of the circuit substrate 1 on which the firstconductor pattern is to be formed is the smaller the better. On theother hand, the side on which the second conductor pattern 12 is to beformed should have surface condition to assure a bonding strength largeenough to withstand the pulling force applied to the first ball-shapedsolder 4 joined to the second conductor pattern 12. In order to increasethe bonding strength, it is necessary to make large the surfaceroughness of the circuit substrate as a means of strengthening thechemical and physical bond between the second conductor pattern and thecircuit substrate.

In an effort to simultaneously solve two conflicting requirements on thecircuit substrate 1, the inventors tried to make the particle size ofalumina powders composing the circuit substrate finer to make thesurface smoother. On the other hand, one side of the circuit substrate,green sheet, is made rough during the process of making a circuitsubstrate in a sheet form, the surface of the other side of the circuitsubstrate was made rough by coating slurry on a film having a surfaceroughness greater than Ra=0.1 μm.

As a result, a surface roughness of Ra=0.20 μm was obtained on thesurface of the circuit substrate on which the first conductor pattern 2is to be formed, and Ra=0.55 μm on the surface on which the secondconductor pattern is to be formed, thereby greatly improving the bondingstrength between the second conductor pattern and the circuit substratefrom 1.9 kg/mm² to 3.1 kg/mm². In association with this, the bondingstrength of the first ball-shaped solder has also been greatly improvedat the same time.

The process of manufacturing packaging substrate such as the formationof the conductor patterns and the first ball-shaped solder is the sameas in the first embodiment and yet the quality obtained was furtherimproved over that of the first embodiment.

(Fifth Embodiment)

Referring to FIG. 9, the fifth embodiment of the method of manufacturingpackaging substrate in accordance with the present invention will beexplained in the following. First, a first conductor pattern 2,electrode inside through hole 32, and a second conductor pattern 12 wereformed by the same processes as employed in the first embodiment.

Next, a dielectric layer 5 was formed by screen printing a dielectricpaste on top of the second conductor pattern 12 and fired at a peaktemperature of 900° C. The thickness of the dielectric layer afterfiring was chosen to be 40 μm. A dielectric material having a specificdielectric constant of 10,000 was used.

Next, using the same Ag--Pd paste as used for the second conductorpattern, a third conductor pattern 22 was formed by printing and firedat a peak temperature of 850° C. As a result, a capacitor has beenformed between the second conductor pattern 12 and the third conductorpattern 22 with a capacitance of 2 μF.

Next, although the electrode is formed in the through hole 32 of thecircuit substrate 1, there is an empty space left. In order to fill theempty space, a high-melting-point solder paste (Pb 90%:Sn 10%) wasfilled by screen printing. FIG. 10(a) is a schematic representation ofthe state of the second solder 14 after the solder paste has been filledin the empty space of the through hole and reflown. As shown in FIG.10(a), in order to fill the empty space so that more solder can beproduced than enough, it is important to make the thickness of the pastelarger on the side of printing, and to allow the solder to flow into thethrough hole during reflow by wetting of the electrode inside thethrough hole.

Also, in order to make the dispersion in quantity of the second solder14 uniform, the portions of the second solder bulging above the surfaceof electrode on the circuit substrate 1 is cut with a sharp knife edge,and the height of the second solder was made uniform as shown in FIG.1(b). The first ball-shaped solder 4 is then formed in the same manneras the first embodiment thus completing a packaging substrate.

As the packaging substrate of the present embodiment has a wiringpattern covered with a dielectric, noise reduction can be achieved by asimple construction utilizing its capacitance, thereby providing apackaging substrate having a high electrical performance. Furthermore,since solder is filled in the empty space of the through hole of thecircuit substrate, the bonding strength between the solder balls and thecircuit substrate is strong and, as a result, the mechanical strengthreliability of the solder balls is high. Also, as the thermalconductivity of solder is high, the heat generated by LSI can beefficiently transferred to the solder balls. As the solder filled in thethrough holes is uniform in height, the first ball-shaped solder to bemounted thereon will have a minimal dispersion in height.

(Sixth Embodiment)

Referring to FIG. 11 and FIG. 12, the sixth embodiment of the method ofmanufacturing a packaging substrate in accordance with the presentinvention will be explained in the following

Starting from the formation of the first conductor pattern 2, the sameprocesses as employed in the first embodiment were employed up to theprocess of formation of the electrode inside through hole 32 and theformation of the second conductor pattern 12.

Next, a first insulating layer 6 and a second insulating layer 16 wereformed by screen printing crystallized glass paste on top of the firstand second conductor patterns, and were simultaneously fired at a peaktemperature of 850° C. The thermal expansion coefficient (α) of thecrystallized glass paste used here was 7.8×10⁻⁶ /°C. The α value of thealumina based circuit substrate 1 was 7.2×10⁻⁶ /°C. It is noted that thefirst insulating layer 6 and the second insulating layer 16 have athermal expansion coefficient ±10% of the thermal expansion coefficientof the circuit substrate. In addition, the first insulating layer 6 andthe second insulating layer 16 can be formed simultaneously.

Next, using a high-melting-point solder paste (Pb 90%:Sn 10%), a secondsolder 14 is formed in the through holes of the circuit substrate in thesame manner as in the fifth embodiment. A first ball-shaped solder 4 wasthen joined to the second solder 14 and the second conductor pattern 12using spheres of high-melting-point solder (Pb 90%:Sn 10%), 0.5 mm indiameter, in the same manner as in the first embodiment, thus obtaininga packaging substrate.

Subsequently, in mounting an LSI chip having bumps onto theabove-mentioned packaging substrate as shown in FIG. 12, eutectic solder(Pb 64%:Sn 36%) was used as the bumps. Also, the bumps 57 had beencoated with a flux prior to mounting. An LSI chip 56 having bumps isplaced on the land portion 61 of the first conductor pattern 2 on thecircuit substrate with the position precisely aligned. The packagingsubstrate and the LSI chip were joined quietly to avoid dislocation bymelting the bumps at 260° C. in a reflow furnace. After joining isfinished, the flux was cleansed to keep the interface between the LSIchip and the substrate clean.

Next, in order to protect the LSI chip 56 and the first conductorpattern 2, a sealing resin 58 was filled in between them and cured at180° C., thus completing an LSI-mounted packaging substrate. The sealingresin used here was epoxy resin blended with fine inorganic powders.

Here, a material having an a value of 7.8×10⁻⁶ /°C. was used as thecrystallized glass paste. When a material with a=9.0×10⁻⁶ /°C. is used,microcracks may be caused in the first insulating layer 6 and the secondinsulating layer 16 due to rapid heating and cooling during theformation of the first and second solders because of the difference in abetween the paste and the circuit substrate 1.

When the first insulation layer 6 is formed but the second insulatinglayer 16 is not formed, even though the difference in α between theinsulating layer and the substrate is very small, warping of thepackaging substrate after firing becomes large. In other words, as thedispersion of the height of the land portion 61 becomes large, mountingdefects tend to occur because some of the bumps 57 may not reach theland portion when mounting an LSI chip 56. In order to avoid thissituation, the first insulating layer 6 and the second insulating layer16 are formed simultaneously and their α was chosen to be within ±10% ofthat of the packaging substrate.

As a result, a packaging substrate has been obtained with a high yieldof mounting even in the case of a fine wiring pattern and in whichmigration does not tend to occur even when using Ag as the conductivematerial as the wiring pattern is covered with an insulating layer.

In this embodiment, an LSI chip was mounted after the first ball-shapedsolder 4 had been joined to the second solder 14 and the secondconductor pattern 12. As an alternative, the first ball-shaped soldercan be joined after mounting an LSI. In this case, it is preferable touse eutectic solder as the first ball-shaped solder 4. Instead of usingthe first ball-shaped solder 4, one can print solder paste in advance onthe printed circuit board on which a packaged substrate is to bemounted, place the substrate, and join them in a reflow furnace.

(Seventh Embodiment)

Referring to FIG. 13 and FIG. 14, a seventh embodiment of themanufacturing method of packaging substrate in accordance with thepresent invention will be explained in the following. First, on theintaglio for forming the first conductor pattern 2, a groove 53 isformed on polyimide film used as a flexible resin base material as isexplained in the aforementioned embodiments. Here, a shallow groove 63is made on a portion of the pattern (the land portion in thisembodiment). To be more specific, using an excimer laser, a groove 53was formed to a depth of 50 μm while a shallow groove 63 was formed to adepth of 20 μm.

The package shown in FIG. 14 was fabricated by the same process as thesixth embodiment including the process of filling a conductive pasteonto an intaglio 50 and drying, and transferring a second conductorpattern 2 onto a circuit substrate 1, the process of forming anelectrode inside through holes 32 and a second conductor pattern 12, theprocess of forming first and second insulating layers 6, 16, and firstand second solders 4, 14, through mounting of an LSI chip 56, but withthe exception of the process of forming the first conductor pattern.

What is different from the sixth embodiment is a thin land portion 71formed on the end portion of the first conductor pattern 2 as shown inFIG. 14. By making the thickness of the first conductor pattern at theland portion thin, it is possible to position an LSI chip on the landportion 71 with high precision and achieve a high yield of mountingwithout loosing placement stability of the LSI chip even when thedistance between bumps 57 of the LSI chip gets smaller, or the bumps getsmaller. To summarize, it has been confirmed that the land portion asshown in the seventh embodiment is furthermore effective in the mountingof an LSI with narrow pitch bumps.

(Eighth Embodiment)

Referring to FIG. 15, the eighth embodiment of the method ofmanufacturing a packaging substrate in accordance with the presentinvention will be explained in the following.

Starting from the formation of the first conductor pattern 2, the sameprocesses as employed in the first embodiment were employed up to theprocess of formation of the electrode inside through hole 32 and theformation of the second conductor pattern 12.

Next, an unfired green sheet was used here as the insulating layer 26.The unfired green sheet was prepared by using the same inorganiccomponent as the crystallized glass paste used in the sixth embodimentfor the purpose of making the α values of the circuit substrate 1 and aninsulating layer 16 substantially the same. The thickness of the greensheet was chosen to be 100 μm. Via holes were punched with a puncher andwere filled with a conductive Ag--Pd paste by screen printing, and thendried. The green sheet thus obtained was positioned on a circuitsubstrate 1, laminated under heat and pressure, and fired at a peaktemperature of 850° C.

Next, a second insulating layer 16 was formed by screen printing usingthe same material as in the sixth embodiment and fired. A fourthconductor pattern 23 was subsequently formed on top of the insulatinglayer 26 by intaglio printing using a Ag paste, and fired. A firstsolder 4 and a second solder 14 were formed and an LSI chip having bumps56 was mounted in the same manner as in the sixth embodiment, and apackaging substrate shown in FIG. 15 was obtained.

When the number of electrode pads of the LSI chip 56 is very large as inthe case of an area pad type, the wiring formed there for connection tothe bumps becomes highly dense in an extremely narrow space. Under sucha situation, the packaging substrate in accordance with the presentembodiment is extremely effective in that the first conductor pattern 2and the fourth conductor pattern 23 are formed by use of a fine andthick wiring pattern made by intaglio printing, and that the connectionof the first conductor pattern 2 and the fourth conductor pattern 23 isdone by means of the electrode inside via hole 42.

(Ninth Embodiment)

Referring to FIG. 16, the ninth embodiment of the method ofmanufacturing a packaging substrate in accordance with the presentinvention will be explained in the following.

Regarding this embodiment, an explanation will be made especially on theprocess of transforming the first ball-shaped solder 4 to a pillar-likeshape. FIG. 16(a) shows a packaging substrate, which is substantiallythe same as in the foregoing embodiments, placed with the firstball-shaped solder 4 upward, and loaded with a casting plate 59 havingholes 60 opposite the first ball-shaped solder 4. The casting plate 59is made of alumina-based ceramic substrate. A ceramic substrate was usedfor the purpose of making the a value of the casting plate 59approximately equal to that of the circuit substrate 1 so as to increasedimensional precision during the heating process to be described later.

Next, the aforesaid casting plate 59 and the packaging substrate wereheated in a reflow furnace to melt the first ball-shaped solder 4, and apillar-shaped solder 24 as shown in FIG. 16(b) was obtained bytransforming the first ball-shaped solder 4 to the same shape as thehole 60. By removing the casting plate 59 after cooling, a packagingsubstrate as shown in FIG. 16(c) was obtained which has the firstpillar-shaped solder 24. In this embodiment, the material used in thefirst ball-shaped solder was eutectic solder (Pb 64%:Sn 36%) while ahigh-melting-point solder (Pb 90%:Sn 10%) was used in the second solder14.

With the packaging substrate having pillar-shaped solder as fabricatedby the present embodiment, it has become possible to withstand heatcycle tests even when the packaging substrate is mounted on a glassepoxy circuit board up to a relatively large size of which the α valuediffers greatly from that of the packaging substrate. The reason isbecause, with the pillar-shaped solder, the height can be made higherthan that of the ball-shaped solder, and thus larger allowance of solderdeformation is available to cope with the stress and strain arising fromthe difference in the α values between glass epoxy circuit board andceramic circuit substrate, thereby minimizing the fatigue of the solder.

Although a ceramic substrate was used in the casting plate 59, whenthere is no necessity to secure high dimensional precision, one can usea metallic plate such as stainless steel or thermosetting resin plate.In case the first pillar-shaped solder 24 shown in FIG. 16(b) greatlyprotrudes from the casting plate, it is useful to cut the protrudingportions with a sharp knife edge and make the height of thepillar-shaped solder uniform.

(Tenth Embodiment)

Referring to FIG. 17, the tenth embodiment of the method ofmanufacturing a packaging substrate in accordance with the presentinvention will be explained in the following. Regarding this embodiment,the method of forming pillar-shaped solder corresponding to the firstball-shaped solder 4 will be explained. FIG. 17(a) shows a packagingsubstrate, which is substantially the same as in the aforementionedembodiments, placed with the second conductor pattern 12 upward, andloaded with a casting plate 59 having holes 60 opposite the secondball-shaped solder 14. A casting plate 59 made of stainless steel wasused because, in filling solder paste into the holes of the castingplate 59 with a squeegee 51 as shown in FIG. 17(a), the wiping operationis smooth as the surface property of the casting plate 59 is superior.

As shown in FIG. 17(b), solder paste 34 is further formed by screenprinting on top of the casting plate 59. This is to supplement thereduction in volume, when molten, of the solder paste filled in theholes 60, which would otherwise cause insufficient height of solder. Bymeans of the solder paste additionally printed on top of the castingplate 59, the holes 60 can be completely filled with solder, therebymaking it possible to form the first pillar-shaped solder 24 with asufficient height as shown in FIG. 17(c).

With the use of a packaging substrate having pillar-shaped solder asformed in accordance with the present embodiment, exactly the sameeffect as the ninth embodiment was obtained.

Although description of the present invention has been made on a ceramictype packaging substrate, the invention is equally conducive to ceramictype pin-grid array (C-PGA) in which pin terminals are provided insteadof the first ball-shaped solder.

As has been described above, with the method of manufacturing of apackaging substrate in accordance with the present invention, it ispossible to implement a hybrid integrated circuit which is low in wiringresistance, small in size, and superior in mountability, by formingconductor circuit pattern on a circuit substrate and forming solderballs as external terminals.

While the present invention has been described with specific referencesto a preferred embodiment. It is apparent that modifications to thecomponents and process flow may be made without departing from thespirit and scope of the invention as set forth in the appended claims.

What is claimed is:
 1. A method of manufacturing a packaging substratewherein a first conductor pattern is formed by intaglio printing on acircuit substrate and a first ball-shaped solder is joined to a secondconductor pattern formed on the opposite side of said circuit substrate,said method comprising processes of:(a) forming an intaglio on thesurface of a flexible material by making a patterned groovecorresponding to the first conductor pattern, (b) repeatedly filling anddrying a conductive paste in the groove of said intaglio, (c)transferring the conductive paste pattern onto the circuit substrate bybonding the intaglio with said circuit substrate through applying heatand pressure, and then peeling off said intaglio from said circuitsubstrate, (d) firing said circuit substrate and said transferredconductive paste pattern, (e) forming said second conductor patternprinted on the side of the circuit substrate opposite to said firstconductor pattern, (f) connecting said second and first conductorpatterns by means of a conductive material located in a through hole ofthe circuit substrate, and (g) joining the first ball-shaped solder tosaid second conductor pattern on the circuit substrate, wherein asurface roughness of said circuit substrate is made larger on a printingsurface of the second conductor pattern than on a printing surface ofthe first conductor pattern.
 2. A method of manufacturing a packagingsubstrate according to claim 1, further comprising a process ofdisposing an adhesive layer between said circuit substrate and saidintaglio after the process of (b).
 3. A method of manufacturing apackaging substrate according to claim 2, wherein said adhesive layercomprises a thermosetting resin or, thermoplastic resin.
 4. A method ofmanufacturing a packaging substrate according to claim 2, wherein saidadhesive layer has a thickness of 20 μm or less.
 5. A method ofmanufacturing a packaging substrate according to claim 1, wherein saidcircuit substrate comprises an unfired green sheet.
 6. A method ofmanufacturing a packaging substrate according to claim 1, wherein saidcircuit substrate is formed in a multilayer wiring configuration.
 7. Amethod of manufacturing a packaging substrate according to claim 1,further comprising processes of forming a dielectric layer on top of aportion of the first conductor pattern or the second conductor pattern,and forming a third conductor pattern on top of said dielectric layer.8. A method of manufacturing a packaging substrate according to claim 1,further comprising processes of covering at least a portion of saidfirst conductor pattern with a first insulating layer, andcovering atleast a portion of said second conductor pattern with a secondinsulating layer, said first and said second insulating layers having athermal expansion coefficient within ±10% of the thermal expansioncoefficient of the circuit substrate.
 9. A method of manufacturing apackaging substrate according to claim 8, wherein said first and saidsecond insulating layers are formed simultaneously.
 10. A method ofmanufacturing a packaging substrate according to claim 1, furthercomprising processes of filling, melting, and solidifying a secondsolder in the empty space of said through hole of the circuit substrate,andjoining a first ball-shaped solder to said second solder and thesecond conductor pattern.
 11. A method of manufacturing a packagingsubstrate according to claim 10, further comprising a process of makingthe height of the second solder uniform before joining said secondsolder with said ball shaped solder.
 12. A method of manufacturing apackaging substrate according to claim 10, wherein said second solderhas a higher melting point than the first ball-shaped solder.
 13. Amethod of manufacturing a packaging substrate according to claim 1 orclaim 10, further comprising processes of forming a first insulatinglayer covering at least a portion of the first conductor pattern,fillinga conductive paste in a via hole portion of said first insulating layer,and forming a fourth conductor pattern on top of said first insulatinglayer.
 14. A method of manufacturing a packaging substrate according toclaim 13, wherein said first insulating layer is formed by laminating anunfired green sheet on top of the said first conductor pattern.
 15. Amethod of manufacturing a packaging substrate according to claim 14,wherein said unfired green sheet comprises substantially the samethermal expansion coefficient values as the circuit substrate.
 16. Amethod of manufacturing a packaging substrate according to claim 13,wherein a LSI chip is mounted by connecting bumps thereof to said fourthconductors on said via hole portions.
 17. A method of manufacturing apackaging substrate according to claim 1 or claim 10, further comprisingprocesses of melting a first solder by heating the circuitsubstrate,forming a pillar shaped solder by disposing said firstball-shaped solder adjacent to a casting plate having holescorresponding in position to said first ball-shaped solder, solidifyingthe pillar-shaped solder and removing said casting plate from saidcircuit substrate.
 18. A method of manufacturing a packaging substratecomprising processes of:(a) forming an intaglio on the surface of aflexible material by making a patterned groove corresponding to a firstconductor pattern, (b) repeatedly filling and drying a conductive pastein the patterned groove of said intaglio, (c) transferring theconductive paste pattern onto the circuit substrate by bonding theintaglio with said circuit substrate through applying heat and pressure,and then peeling off said intaglio from said circuit substrate, (d)firing said circuit substrate and said transferred conductive pastepattern, and (e) forming a second conductor pattern printed on the sideof the circuit substrate opposite to said first conductor pattern;wherein a surface roughness of said circuit substrate is made larger ona printing surface of the second conductor pattern than on a printingsurface of the first conductor pattern.
 19. A method of manufacturing apackaging structure wherein a first conductor pattern is formed byintaglio printing on a circuit substrate and a first ball-shaped solderis joined to a second conductor pattern formed on the opposite side ofsaid circuit substrate, said method comprising processes of:(a) formingan intaglio on the surface of a flexible material by making a patternedgroove corresponding to the first conductor pattern, wherein saidforming an intaglio comprises forming a thinner land portion of thefirst conductor pattern in a shallower groove of the intaglio comprisingat least two depths of grooves, (b) repeatedly filling and drying aconductive paste in the groove of said intaglio, (c) transferring theconductive paste pattern onto the circuit substrate by bonding theintaglio with said circuit substrate through applying heat and pressure,and then peeling off said intaglio from said circuit substrate, (d)firing said circuit substrate and said transferred conductive pastepattern, (e) forming said second conductor pattern printed on the sideof the circuit substrate opposite to said first conductor pattern, (f)connecting said second and first conductor patterns by means of aconductive material located in a through hole of the circuit substrate,(g) joining the first ball-shaped solder to said second conductorpattern on the circuit substrate, and (h) electrically connecting an LSIchip having bumps through said bumps by face-down mounting on saidthinner land portion of the first conductor pattern.
 20. A method ofmanufacturing a packaging substrate wherein a first conductor pattern isformed by intaglio printing on a circuit substrate and a firstpillar-shaped solder is joined to a second conductor pattern formed onthe opposite side of said circuit substrate, said method comprisingprocesses of:(a) forming an intaglio on the surface of a flexiblematerial by making a patterned groove corresponding to the firstconductor pattern, (b) repeatedly filling and drying a conductive pastein the groove of said intaglio, (c) transferring the conductive pastepattern onto the circuit substrate by bonding the conductive pastefilled side of the intaglio with said circuit substrate through applyingheat and pressure, and then peeling off said intaglio from said circuitsubstrate, (d) firing said circuit substrate and said transferredconductive paste pattern, (e) forming said second conductor patternprinted on the side of the circuit substrate opposite to said firstconductor pattern, (f) connecting said second and first conductorpatterns by means of a conductive material located in a through hole ofthe circuit substrate, (g) filling, melting, and solidifying a secondsolder in the empty space of said through hole of the circuit substrate,(h) making a casting plate having holes come in close contact with asubstrate surface of said circuit substrate on which the secondconductor pattern is formed, (i) applying a solder paste in the holes,or in the holes and their peripheral of said casting plate, (j) pouringthe solder into the holes of said casting plate by melting the solderpaste thereby forming a first pillar-shaped solder, and (k) removingsaid casting plate from said circuit substrate after said firstpillar-shaped solder has been solidified, wherein a surface roughness ofsaid circuit substrate is made larger on a printing surface of thesecond conductor pattern than on a printing surface of the firstconductor pattern.
 21. A method of manufacturing a packaging substrateaccording to claim 20, wherein said second solder has a higher meltingpoint than the first pillar-shaped solder.